Fatigue Characteristics of Lead-Free Solder Alloys.
نویسندگان
چکیده
منابع مشابه
Development of Sn-Zn-Al Lead-Free Solder Alloys
Fujitsu has implemented a company-wide effort to progressively reduce the use of lead (Pb) and eventually eliminate this environmental pollutant from its products. As part of this effort, we have developed a new lead-free solder that consists of tin (Sn), zinc (Zn), and aluminum (Al) and yet offers superior productivity and joint reliability. The new lead-free solder has a melting point equival...
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Competing mechanisms of electromigration and thermomigration in flip chip SnAgCu (SAC) solder joints was studied experimentally. A chain of solder joints were stressed at 2.0 × 10 Amps/cm, 2.4 × 10 Amps/cm, and 2.8 × 10 Amps/cm current density at room temperature. In the test vehicle, some solder joints were exposed to a combination of electromigration and thermomigration, while some others wer...
متن کاملThermal Fatigue Assessment of Lead-Free Solder Joints
In this paper the authors have investigated the thermal fatigue reliability of lead-free solder joints. They have focused their attention to the formation of the intermetallic compound and its effect on the initiation and propagation behaviors of fatigue cracks. Furthermore, they also studied the effect of voids in the solder joints on the fatigue reliability. An isothermal fatigue test method ...
متن کاملLead-free Solder Assembly
Until non-lead solder conversion is mature, the evaluation of materials and components is likely to identify trade-offs. The performance of the no-clean andwater-soluble solder pastes that were tested varied widely. Ultimately each company will need to determine which attributes are most important for their product line. Also components needed for a product may not be currently available as lea...
متن کاملSolder Creep-Fatigue Model Parameters for SAC & SnAg Lead-Free Solder Joint Reliability Estimation
For many of the Pb-free solders required under the European RoHS directive, there is now sufficient information, primarily in the form of the results of accelerated thermal cycling of various levels of severity, to develop acceleration models for the creep-fatigue of these solders. In this paper the parameters for the SAC405/305, SAC205, SAC105 and SnAg to replace the parameters for eutectic Sn...
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ژورنال
عنوان ژورنال: Materia Japan
سال: 1999
ISSN: 1340-2625,1884-5843
DOI: 10.2320/materia.38.937